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ME 51100 - Heat Transfer In Electronic Systems |
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Associated Term:
Summer 2024
Learning Outcomes: 1. Introduce concepts in thermal management of electronics to senior undergraduate and graduate students and practicing engineers. 2. Provide an appreciation for the applications of first principles to electronics cooling and packaging problems in industry. 3. Provide students with sound tools to approach existing packaging and cooling applications, while also raising awareness of novel techniques at the cutting edge. Required Materials: Technical Requirements: |
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