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| MSE 23000 - Structure And Properties Of Materials |
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Associated Term:
Spring 2024
Learning Outcomes: 1. Recognize basic MSE nomenclature, basic microstructure, associate terms with the appropriate structure/phenomena, and be able to differentiate between related structures/phenomena. Examples: FCC and BCC crystal structures; Ionic and Covalent crystal structures; Elastic and Plastic deformation; Isomorphous and eutectic phase diagrams; Interstitial and vacancy diffusion mechanisms; Polymers exhibit a distribution of molecular weights; Identifying and drawing crystallographic planes and directions. 2. Perform simple calculations to quantify material properties and microstructural characteristics. Examples: Interplanar spacing of a family of atomic planes given an x-ray diffraction pattern; Equilibrium vacancy concentration at a given temperature; Dimensional changes associated with elastic and plastic deformation; Fracture strength for a given flaw size; Phase composition and fraction using phase diagrams; Apply Reuss and Voight models to determine modulus of composites. 3. Recognize the effect of composition and microstructure on material properties. Examples: Hall-Petch effect; Dislocation density effect on yield strength and electrical conductivity; Alloying effect on yield strength and electrical conductivity; Inverse relationship between yield strength and fracture toughness; Correlation between type of atomic bonding and the mechanical and electrical properties of different classes of materials. 4. Take information from a known situation and apply it to a new situation. Examples: Effect of temperature and applied stress on the peak positions in an XRD pattern; Simple calculations with multiple steps. 5. Predict property response or microstructural changes based on imposed conditions. Examples: Predicting microstructure using a phase diagram; Predicting microstructure using a TTT diagram; Effects of temperature and alloying on the resistivity of metals. 6. Assess the interplay of two material properties. Examples: Effect of atomic bond strength on Young’s modulus, coefficient of thermal expansion and melting temperature; Determine if a material will yield or rupture at a given applied stress. 7. Identify, formulate, and solve complex materials engineering problems by applying principles of engineering, science, and mathematics. Required Materials: Technical Requirements: |
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